Die Bonder Hybrid DATACON - 2200 evo

Die Bonder Hybrid, DATACON - 2200 evo Vintage 2016, Gen3 1.Location, CMTec AG, Switzerland 2.EVO Generation, Generation 3 3. Software version, on request 4.Operation system, on request 5.Condition, refurbished 6.Wafermapping, Yes 7.Single Component Tracking, Yes 8.Vintage, 2016 Main System 10.Bondhead, Standard 11.Time-pressure dispenser, Yes 12.Volumetric dispenser, no / on request 13.Musashi dispenser, no / on request 14.Substrate camera, Yes 15.Toolbank, Yes 7 position 16.Squeegee unit, no / on request 17.Flipchip unit, no / on request 18.Fluxslider, no / on request 19.Wafertable, Yes, 6 to 12 inch 20.Wafer magazine lift, Yes 21.Wafercamera, Yes 22.Ejector system, Yes 23.Ejector carusell, Yes 24.Uplooking camera, Yes 25.Static wafflepack holder, no / on request ID System 26. Bondhead, No 27.Time-pressure dispenser, Yes 28.Volumetric dispenser, no / on request 29.Musashi dispenser, no / on request 30.Substrate camera, Yes 31.Squeegee unit, No Transport system standart Type one 32.Inputbuffer, no / on request 33.Outputbuffer, no / on request 34.Input magazine handler, no / on request 35.Output magazine handler, no / on request Customized options P-Parts, no / on request 36.Heated P-Part, no / on request 37. Process related tools, no / on request 38. Calibration & Service tools, no / on request configuration as required.